Ergebnisse für: RF packaging

Hier findest Du Bücher, die sich mit RF packaging beschäftigen.

Buch Cover RF and Microwave Integrated Circuit Development
RF and Microwave Integrated Circuit Development bridges the gap between existing literature, which focus mainly on the 'front-end' part of a product development (system, architecture, design techniques), by providing the reader with an insight into the 'back-end' part of product development. In addi...
Buch Cover RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...
Buch Cover RF and Microwave Microelectronics Packaging II
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging a...
Buch Cover Advanced Millimeter-wave Technologies
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packagin...
Buch Cover Bandwidth and Efficiency Enhancement in Radio Frequency Power Amplifiers for Wireless Transmitters
This book focuses on broadband power amplifier design for wireless communication. Nonlinear model embedding is described as a powerful tool for designing broadband continuous Class-J and continuous class F power amplifiers. The authors also discuss various techniques for extending bandwidth of load ...
Buch Cover Microwave Filters for Communication Systems
An in-depth look at the state-of-the-art in microwave filter design, implementation, and optimization Thoroughly revised and expanded, this second edition of the popular reference addresses the many important advances that have taken place in the field since the publication of the first edition and ...
Buch Cover Microwave Filters for Communication Systems
An in-depth look at continuing advances in the field of microwave filters-the basic building blocks of any communication system There have been significant advances in the synthesis and physical realization of microwave filter networks, but until now, no book has provided a coherent and readable de...
Buch Cover RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...
Buch Cover RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...
Buch Cover RF and Microwave Microelectronics Packaging II
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging a...
Buch Cover RF and Microwave Microelectronics Packaging II
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging a...
Buch Cover Three-Dimensional Integration and Modeling

Springer International Publishing
35.3 € · eBook
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Buch Cover Three-Dimensional Integration and Modeling

Springer International Publishing
35.3 € · Paperback
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Buch Cover Advanced Millimeter-wave Technologies

John Wiley & Sons
129.99 € · eBook
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Buch Cover RFID and Sensor Network Automation in the Food Industry

John Wiley & Sons
140.99 € · eBook
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Buch Cover RFID and Sensor Network Automation in the Food Industry

John Wiley & Sons
140.99 € · eBook
...
Buch Cover Development and evaluation of a GaAs based 300 GHz module

Fraunhofer Verlag
71 € · Paperback
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Buch Cover SiP System-in-Package Design and Simulation

John Wiley & Sons
124.99 € · eBook
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Buch Cover Bandwidth and Efficiency Enhancement in Radio Frequency Power Amplifiers for Wireless Transmitters

Springer International Publishing
117.69 € · eBook
...
Buch Cover SiP System-in-Package Design and Simulation

John Wiley & Sons
124.99 € · eBook
...

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