Waver level packaging – Bücher zum Thema Waver level packaging finden und kaufen

RF and Microwave Microelectronics Packaging II

Springer International Publishing
139.09 € · Hardcover

Microwave and millimeter-wave frequencies EMI shielding Chip size packaging for RF MEMS Ceramic and Laminate packaging High power electronics Thermal management system design Thin film substrate Advanced power amplifiers Millimeter wave circuit technology Quality control and failure analysis Waver level packaging System integration packaging technologies High thermal conductivity

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging a...

RF and Microwave Microelectronics Packaging II

Springer International Publishing
139.09 € · Paperback

Microwave and millimeter-wave frequencies EMI shielding Chip size packaging for RF MEMS Ceramic and Laminate packaging High power electronics Thermal management system design Thin film substrate Advanced power amplifiers Millimeter wave circuit technology Quality control and failure analysis Waver level packaging System integration packaging technologies High thermal conductivity

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging a...

RF and Microwave Microelectronics Packaging II

Springer International Publishing
128.39 € · eBook

Microwave and millimeter-wave frequencies EMI shielding Chip size packaging for RF MEMS Ceramic and Laminate packaging High power electronics Thermal management system design Thin film substrate Advanced power amplifiers Millimeter wave circuit technology Quality control and failure analysis Waver level packaging System integration packaging technologies High thermal conductivity

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging a...

Ergebnisse für: Waver level packaging

Hier findest Du Bücher, die sich mit Waver level packaging beschäftigen.