Ergebnisse für: Glass Substrate

Hier findest Du Bücher, die sich mit Glass Substrate beschäftigen.

Buch Cover Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering prac...
Buch Cover Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved...
Buch Cover Wet chemical deposition of transparent conducting coatings made of redispersable crystalline ITO nanoparticles on glass and polymeric substrates
Bei der Kontrolle der Oberflächenmodifizierung und dem Wachstumsprozess wurden leitfähige kristalline Zinn-dotierte Indium-Oxid (ITO) Partikel erfolgreich hergestellt. Die Partikel sind hochdicht, ihre Größe wächst mit den Sintertemperaturen, und sie haben eine Teilchengröße von 20-35nm. Die...
Buch Cover Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering prac...
Buch Cover Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved...
Buch Cover Polycrystalline Semiconductors V
Like the previous conferences in this series, POLYSE '98 covered many aspects of polycrystalline semiconductors. Whereas earlier proceedings had included many contributions on basic research, for example on the structural properties of single grain boundaries, later proceedings had included more art...

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