Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
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Beschreibung
This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as Cu interconnects, glass-core substrate, 3D heterogeneous integration of photonic IC and electronic IC, and combining simulation design with AI technology to effectively apply it to semiconductor packaging.
This book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as Cu interconnects, glass-core substrate, 3D heterogeneous integration of photonic IC and electronic IC, and combining simulation design with AI technology to effectively apply it to semiconductor packaging.
This book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Contains in-depth coverage of Cu interconnects, glass substrates, 3D PIC/EIC integration, fatigue, FE, machine learning Provides studies on chiplets and heterogeneous integration: design, materials, process, reliability, modeling, AI model Authored by contributors from leading industrial and academic institutions
Autor*in
John Lau
Themen in »Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration«
Cu-interconnects Glass-core substrate Photonic IC and Electronic IC Fatigue-Fracture AI-assisted simulations Reliability