Ergebnisse für: Semiconductor Packaging

Hier findest Du Bücher, die sich mit Semiconductor Packaging beschäftigen.

Buch Cover Semiconductor Advanced Packaging
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on ...
Buch Cover Packaging of High Power Semiconductor Lasers
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail....
Buch Cover Microelectronics Packaging Handbook
R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Springer US
374.49 € · Hardcover
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current...
Buch Cover Semiconductor Power Devices
Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
Springer International Publishing
320.99 € · Hardcover
Fast Diodes IGBT MOFSET Packaging Technology Power Electronics
This book discusses semiconductor properties, pn-junctions and the physical phenomena for understanding power devices in depth. Working principles of state-of-the-art power diodes, thyristors, MOSFETs and IGBTs are explained in detail, as well as key aspects of semiconductor device product...
Buch Cover Semiconductor Power Devices
Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik DeDoncker
Springer International Publishing
213.99 € · Hardcover
Fast Diodes IGBT MOFSET Packaging Technology
This new edition of the book Semiconductor Power Devices is now divided into two volumes. Volume 2 focuses on Packaging, Cooling, Reliability, and Advanced Design Aspects of Power Devices. Readers will find in-depth coverage of packaging technologies, including conventional and advanced concepts for...
Buch Cover Semiconductor Power Devices
Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
Springer Berlin
235.39 € · Hardcover
Fast Diodes IGBT MOFSET Packaging Technology
Semiconductor power devices are the heart of power electronics. They determine the performance of power converters and allow topologies with high efficiency. Semiconductor properties, pn-junctions and the physical phenomena for understanding power devices are discussed in depth. Working principles o...
Buch Cover Semiconductor Power Devices
Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik DeDoncker
Springer International Publishing
299.59 € · Hardcover
Fast Diodes IGBT MOFSET Packaging Technology Power Electronics
This new edition of the book Semiconductor Power Devices is now divided into two volumes. This first volume focuses on the Physics, Technology, and Design of Power Devices. It provides a comprehensive explanation of the physical principles essential for understanding modern power devices. The comple...
Buch Cover Semiconductor Advanced Packaging
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on ...
Buch Cover Semiconductor Advanced Packaging
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on ...
Buch Cover Packaging of High Power Semiconductor Lasers
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail....
Buch Cover Packaging of High Power Semiconductor Lasers
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail....
Buch Cover Microelectronics Packaging Handbook
R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Springer US
362.73 € · eBook
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current...
Buch Cover Semiconductor Power Devices
Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik DeDoncker
Springer International Publishing
298.53 € · eBook
Fast Diodes IGBT MOFSET Packaging Technology Power Electronics
This new edition of the book Semiconductor Power Devices is now divided into two volumes. This first volume focuses on the Physics, Technology, and Design of Power Devices. It provides a comprehensive explanation of the physical principles essential for understanding modern power devices. The comple...
Buch Cover Semiconductor Power Devices
Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
Springer International Publishing
223.63 € · eBook
Fast Diodes IGBT MOFSET Packaging Technology Power Electronics
This book discusses semiconductor properties, pn-junctions and the physical phenomena for understanding power devices in depth. Working principles of state-of-the-art power diodes, thyristors, MOSFETs and IGBTs are explained in detail, as well as key aspects of semiconductor device product...
Buch Cover Semiconductor Power Devices
Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
Springer Berlin
160.49 € · eBook
Fast Diodes IGBT MOFSET Packaging Technology
Semiconductor power devices are the heart of power electronics. They determine the performance of power converters and allow topologies with high efficiency. Semiconductor properties, pn-junctions and the physical phenomena for understanding power devices are discussed in depth. Working principles o...
Buch Cover Semiconductor Power Devices
Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik DeDoncker
Springer International Publishing
213.99 € · eBook
Fast Diodes IGBT MOFSET Packaging Technology
This new edition of the book Semiconductor Power Devices is now divided into two volumes. Volume 2 focuses on Packaging, Cooling, Reliability, and Advanced Design Aspects of Power Devices. Readers will find in-depth coverage of packaging technologies, including conventional and advanced concepts for...
Buch Cover Semiconductor Power Devices
Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
Springer Berlin
165.84 € · Paperback
Fast Diodes IGBT MOFSET Packaging Technology
Semiconductor power devices are the heart of power electronics. They determine the performance of power converters and allow topologies with high efficiency. Semiconductor properties, pn-junctions and the physical phenomena for understanding power devices are discussed in depth. Working principles o...
Buch Cover Semiconductor Power Devices
Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
Springer International Publishing
235.39 € · Paperback
Fast Diodes IGBT MOFSET Packaging Technology Power Electronics
This book discusses semiconductor properties, pn-junctions and the physical phenomena for understanding power devices in depth. Working principles of state-of-the-art power diodes, thyristors, MOSFETs and IGBTs are explained in detail, as well as key aspects of semiconductor device product...
Buch Cover Silicon Semiconductor Technology
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail,...
Buch Cover Silicon Semiconductor Technology
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail,...

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