Ergebnisse für: Seed Layer

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Buch Cover Multiscale Simulation of Metallic Copper and Copper Oxide Atomic Layer Deposition from Cu Beta-diketonates
Copper (Cu) interconnects have been widely used to replace aluminum in ultra-large-scale integration due to low resistivity and superior resistance to electromigration. Current processes for the fabrication of interconnects require thin Cu seed layers before the subsequent Cu filling by electrochemi...
Buch Cover Biofuel and Bioenergy Technology
The subject of this book is "Biofuel and Bioenergy Technology". It aims to publish high-quality review and research papers, addressing recent advances in biofuel and bioenergy. State-of-the-art studies of advanced techniques of biorefinery for biofuel production are also included. Research involving...
Buch Cover Energy, Environment and Biological Materials
These 64 peer-reviewed papers cover the latest data found by researchers working in the fields of solar cells, eco-materials and technologies related to climate change and bio-medical materials. As such, they will be essential reading for those involved in those fields. ...

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