Ergebnisse für: FOWLP reliability

Hier findest Du Bücher, die sich mit FOWLP reliability beschäftigen.

Buch Cover Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
John H. Lau
Springer Singapore
160.49 € · Hardcover
Fan-Out Wafer-Level Packaging (FOWLP) Fan-out Panel-Level Packaging (FOPLP) Reconstituted carrier RDL (redistribution layer) – dielectric and conductor layers FOWLP with chip-first and die face-down FOWLP with chip-first and die face-up FOWLP with chip-last or RDL-first EMC (epoxy molding compound) Compression molding and PMC (post mold cure) Warpage and die shift Temporary bonding and de-bonding 3D IC heterogeneous integration by FOWLP FOWLP thermal management FOWLP reliability FOWLP technology
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semi...
Buch Cover Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
John H. Lau
Springer Singapore
106.99 € · eBook
Fan-Out Wafer-Level Packaging (FOWLP) Fan-out Panel-Level Packaging (FOPLP) Reconstituted carrier RDL (redistribution layer) – dielectric and conductor layers FOWLP with chip-first and die face-down FOWLP with chip-first and die face-up FOWLP with chip-last or RDL-first EMC (epoxy molding compound) Compression molding and PMC (post mold cure) Warpage and die shift Temporary bonding and de-bonding 3D IC heterogeneous integration by FOWLP FOWLP thermal management FOWLP reliability FOWLP technology
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semi...
Buch Cover Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
John H. Lau
Springer Singapore
117.69 € · Paperback
Fan-Out Wafer-Level Packaging (FOWLP) Fan-out Panel-Level Packaging (FOPLP) Reconstituted carrier RDL (redistribution layer) – dielectric and conductor layers FOWLP with chip-first and die face-down FOWLP with chip-first and die face-up FOWLP with chip-last or RDL-first EMC (epoxy molding compound) Compression molding and PMC (post mold cure) Warpage and die shift Temporary bonding and de-bonding 3D IC heterogeneous integration by FOWLP FOWLP thermal management FOWLP reliability FOWLP technology
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semi...
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