Ergebnisse für: Compound Material

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Buch Cover Electron Transport in Compound Semiconductors
Discovery of new transport phenomena and invention of electron devices through exploitation of these phenomena have caused a great deal of interest in the properties of compound semiconductors in recent years. Extensive re search has been devoted to the accumulation of experimental results, par ticu...
Buch Cover Compound and Josephson High-Speed Devices
In recent years, III-V devices, integrated circuits, and superconducting integrated circuits have emerged as leading contenders for high-frequency and ultrahigh speed applications. GaAs MESFETs have been applied in microwave systems as low-noise and high-power amplifiers since the early 1970s, repla...
Buch Cover Thin Films Material Technology
Kiyotaka Wasa, Makoto Kitabatake, Hideaki Adachi
Springer Berlin
160.49 € · Hardcover
Sputtering Systems Structural Control Thin Films
An invaluable resource for industrial science and engineering newcomers to sputter deposition technology in thin film production applications, this book is rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin film, a key techno...
Buch Cover Electron Transport in Compound Semiconductors
Discovery of new transport phenomena and invention of electron devices through exploitation of these phenomena have caused a great deal of interest in the properties of compound semiconductors in recent years. Extensive re search has been devoted to the accumulation of experimental results, par ticu...
Buch Cover Electron Transport in Compound Semiconductors
Discovery of new transport phenomena and invention of electron devices through exploitation of these phenomena have caused a great deal of interest in the properties of compound semiconductors in recent years. Extensive re search has been devoted to the accumulation of experimental results, par ticu...
Buch Cover Compound and Josephson High-Speed Devices
In recent years, III-V devices, integrated circuits, and superconducting integrated circuits have emerged as leading contenders for high-frequency and ultrahigh speed applications. GaAs MESFETs have been applied in microwave systems as low-noise and high-power amplifiers since the early 1970s, repla...
Buch Cover Compound and Josephson High-Speed Devices
In recent years, III-V devices, integrated circuits, and superconducting integrated circuits have emerged as leading contenders for high-frequency and ultrahigh speed applications. GaAs MESFETs have been applied in microwave systems as low-noise and high-power amplifiers since the early 1970s, repla...
Buch Cover Thin Films Material Technology
Kiyotaka Wasa, Makoto Kitabatake, Hideaki Adachi
Springer Berlin
171.15 € · Paperback
Sputtering Systems Structural Control Thin Films
An invaluable resource for industrial science and engineering newcomers to sputter deposition technology in thin film production applications, this book is rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin film, a key techno...
Buch Cover Characterisation and Modelling of Continuous-Discontinuous Sheet Moulding Compound Composites for Structural Applications
The main objective of this work is to significantly deepen the understanding of the material and the structural behaviour of continuous-discontinuous SMC composites, following a holistic approach to investigate microscopic aspects, macroscopic mechanical behaviour as well as failure evolution at the...
Buch Cover Experimental investigation and process simulation of the compression molding process of Sheet Molding Compound (SMC) with local reinforcements
In this book, a new three-dimensional approach for the process simulation of SMC is developed. This approach takes into account both, the core layer that is dominated by the extensional viscosity and the thin lubrication layer. In order to transfer the information from the process to the structure s...
Buch Cover Surface shape deviations in face milling of multi-material-designed components
Multi-material-designed components allow engineers to compose each zone of a component with the most qualified material in accordance with local demands. In machining of multi-material-designed components new challenges arise. Significant shape deviations of workpiece surfaces occur that do not occu...
Buch Cover Surface shape deviations in face milling of multi-material-designed components
Multi-material-designed components allow engineers to compose each zone of a component with the most qualified material in accordance with local demands. In machining of multi-material-designed components new challenges arise. Significant shape deviations of workpiece surfaces occur that do not occu...
Buch Cover Material- und Verfahrensentwicklung zur Herstellung von glasfaserverstärkten duromeren Bauteilen im Direktverfahren (Direkt-SMC).
Im Bereich der langglasfaserverstärkten Thermoplaste haben sich Direktverfahren mit in-line Compoundierung des Matrixpolymers (LFT-D-ILC) bereits erfolgreich gegenüber den halbzeugbasierten Faserverbundwerkstoffen durchgesetzt, da sie den steigenden Anforderungen in Hinblick auf Kosten, Zykluszeit...
Buch Cover Physical Models of Semiconductor Quantum Devices

Springer US
169.99 € · eBook
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Buch Cover Supramolecular Assemblies of Cucurbit[n]urils with Metal Ions

Springer Berlin
53.49 € · eBook
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Buch Cover Water Soluble Polymers

Springer US
96.29 € · eBook
...
Buch Cover Phenolic Resins

Springer Berlin
469.73 € · eBook
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Buch Cover Zum dynamischen Verhalten eines biologischen Rieselbettreaktors mit adsorbierenden Trägermaterialien.

Fraunhofer IRB Verlag
36 € · Paperback
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Buch Cover Mobilität von Nitroaromaten in natürlichen Bodenprofilen
Die Zahl der mit Sprengstoffen belasteten Flächen übersteigt allein in Deutschland mehrere Tausend. Neben den hochbelasteten Produktions-, Brand- und Sprengplätzen spielt immer wieder die Frage nach dem Boden-Sanierungswert gering belasteter Flächen eine wichtige Rolle. In diesem Zusammenhang wu...
Buch Cover Multiscale, Multifunctional and Functionally Graded Materials

Trans Tech
· Paperback
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