Ergebnisse für: Ball Grid Array BGA

Hier findest Du Bücher, die sich mit Ball Grid Array BGA beschäftigen.

Buch Cover Solder Joint Reliability Assessment
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...
Buch Cover Solder Joint Reliability Assessment
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...
Buch Cover Solder Joint Reliability Assessment
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover...

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