This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
Focuses on the thermal reliability of power semiconductor device in the renewable energy system Offers abundant experimental tests to explain the device thermal reliability improvement techniques Discusses the development trend and future expectations of power semiconductor device thermal reliability
Xiong Du
Thermal Reliability Failure mechanism Thermal parameters monitoring Junction temperature estimation Lifetime evaluation Thermal management