More-than-Moore 2.5D and 3D SiP Integration
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Beschreibung
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.
Provides a detailed review of the state-of-the-art in More-than-Moore technology options, including strengths and weaknesses of each Discusses the technical tradeoffs in the process, design, packaging and architecture domains, required to optimize microelectronic products that leverage these technologies Includes discussion of the product management perspectives on advanced and disruptive technology options Includes supplementary material: sn.pub/extras
Autor*in
Riko Radojcic
Themen in »More-than-Moore 2.5D and 3D SiP Integration«
3D Integrated Circuits 2.5/3D Integration Low-dimensional nanoensembles Fabless vs Foundry Advanced packaging technologies for microelectronics