Electronic Materials Innovations and Reliability in Advanced Memory Packaging
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Beschreibung
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
Describes advanced memory packaging from components to systems, exploring materials and innovations A must-have resource on comprehensive materials reliability in memory device packaging for researchers and engineers With a special emphasis on system-level packaging, integrating memory modules and SSD
Autor*in
Chong Leong Gan
Themen in »Electronic Materials Innovations and Reliability in Advanced Memory Packaging«
Semiconductor Packaging Electronic Packaging Materials Materials Innovations Hardware Engineering Reliability Memory Device Packaging