Ergebnisse für: Interconnect materials

Hier findest Du Bücher, die sich mit Interconnect materials beschäftigen.

Buch Cover Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

Springer Singapore
171.19 € · Hardcover
...
Buch Cover Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

Springer Singapore
192.59 € · Hardcover
...
Buch Cover Interconnect Reliability in Advanced Memory Device Packaging

Springer International Publishing
213.99 € · Hardcover
...
Buch Cover Three-Dimensional Molded Interconnect Devices (3D-MID)

Hanser Publications
159.99 € · Hardcover
...
Buch Cover Materials for Advanced Packaging

Springer US
213.99 € · Hardcover
...
Buch Cover Harsh Environment Electronics

Wiley-VCH
169 € · Hardcover
...
Buch Cover Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

Springer Singapore
139.09 € · Paperback
...
Buch Cover Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

Springer Singapore
128.39 € · Paperback
...
Buch Cover Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

Springer Singapore
128.39 € · eBook
...
Buch Cover Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

Springer Singapore
160.49 € · eBook
...
Buch Cover Interconnect Reliability in Advanced Memory Device Packaging

Springer International Publishing
213.99 € · eBook
...
Buch Cover Interconnect Reliability in Advanced Memory Device Packaging

Springer International Publishing
213.99 € · Paperback
...
Buch Cover Three-Dimensional Molded Interconnect Devices (3D-MID)

Hanser Publications
139.99 € · eBook (Download)
...
Buch Cover Micromechanical studies of interface properties in on-chip interconnect structures

Fraunhofer Verlag
37 € · Paperback
...
Buch Cover Materials for Advanced Packaging

Springer US
139.09 € · Paperback
...
Buch Cover Materials for Advanced Packaging

Springer US
171.19 € · eBook
...
Buch Cover Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Springer US
534.99 € · SA
...
Buch Cover Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Springer US
523.23 € · eBook
...
Buch Cover Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Springer US
534.99 € · SA
...
Buch Cover Harsh Environment Electronics

Wiley-VCH
151.99 € · eBook (Download)
...

Über buchnah.de | Die Buchhandlungen | Die Verlage | Impressum & Kontakt | Datenschutz | Presse


Auf dieser Seite kannst Du Buchhandlungen in der Nähe finden