Ergebnisse für: Bridge in substrate

Hier findest Du Bücher, die sich mit Bridge in substrate beschäftigen.

Buch Cover Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Springer Singapore
181.89 € · Hardcover
...
Buch Cover Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Springer Singapore
192.59 € · Hardcover
...
Buch Cover Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Springer Singapore
181.89 € · eBook
...
Buch Cover Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Springer Singapore
139.09 € · Paperback
...
Buch Cover Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Springer Singapore
181.89 € · eBook
...

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