Tavares Data Science and Communication

Data Science and Communication

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Proceedings of ICTDsC 2023

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Beschreibung

The book presents selected papers from the International Conference on Data Science and Communication (ICTDsC 2023) organized by the Department of Electronics and Communication Engineering and Department of Engineering Science and Humanities (DESH) Siliguri Institute of Technology, India during 23 – 24 March 2023 in Siliguri, India. The book covers state-of-the-art research insights on artificial intelligence, machine learning, big data, data analytics, cyber security and forensic, network and mobile security, advanced computing, cloud computing, quantum computing, electronics system, Internet of Things, robotics and automations, blockchain and software technology, and digital technologies for future.


The book presents selected papers from the International Conference on Data Science and Communication (ICTDsC 2023) organized by the Department of Electronics and Communication Engineering and Department of Engineering Science and Humanities (DESH) Siliguri Institute of Technology, India during 23 – 24 March 2023 in Siliguri, India. The book covers state-of-the-art research insights on artificial intelligence, machine learning, big data, data analytics, cyber security and forensic, network and mobile security, advanced computing, cloud computing, quantum computing, electronics system, Internet of Things, robotics and automations, blockchain and software technology, and digital technologies for future.


Presents recent innovative research in the field of data science and communication Discusses the outcomes of ICTDsC 2023, held in Siliguri, India Serves as a reference resource for researchers and practitioners in academia and industry

Autor*in

João Manuel R. S. Tavares

Themen in »Data Science and Communication«

Network Security and Telecommunication Machine Intelligence Human Computer Interaction Advance Computing ICTDsC 2023 Proceedings

Stimmen zu »Data Science and Communication«

Details

ISBN: 9789819954353
Verlag: Springer Singapore
Erscheinung: 02.01.2024

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