Nguyen Intelligent Systems and Networks

Intelligent Systems and Networks

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Selected Articles from ICISN 2023, Vietnam

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Beschreibung

This book presents Proceedings of the International Conference on Intelligent Systems and Networks (ICISN 2021), held at Hanoi in Vietnam. It includes peer-reviewed high-quality articles on intelligent system and networks. It brings together professionals and researchers in the area and presents a platform for exchange of ideas and to foster future collaboration. The topics covered in this book include—foundations of computer science; computational intelligence language and speech processing; software engineering software development methods; wireless communications signal processing for communications; electronics track IoT and sensor systems embedded systems; etc.
This book presents Proceedings of the International Conference on Intelligent Systems and Networks (ICISN 2023), held at Hanoi in Vietnam. It includes peer reviewed high impact research manuscripts, that highlight the work based on Intelligent System and Networks. The book presents ongoing research outcomes, results and cutting edge works which are of importance to professionals and academics/researchers. It covers topics such as Computational Intelligence in Language and Speech Processing; Software development methods; Wireless Communications and Signal Processing; IoT and Sensor Embedded Systems ; etc.


Includes Proceedings of the International Conference on Intelligent Systems and Networks (ICISN 2023), held at Hanoi Presents a platform for exchange of ideas on latest advance in the field and to foster future collaboration Is contributed by leading experts from both industry and academia

Autor*in

Thi Dieu Linh Nguyen

Themen in »Intelligent Systems and Networks«

Data structures Language theory Cryptography Distributed systems Computer security Computer vision Bioinformatics Machine learning Data mining Agent-based systems Embedded system Human-computer interface Grid computing Cloud computing Deep learning

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Details

ISBN: 9789819947270
Verlag: Springer Singapore
Erscheinung: 21.08.2024

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