Wanping Wu Wu Specifications for Design of Highway Substructure

Specifications for Design of Highway Substructure

von Wanping Wu

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Beschreibung

This book is formulated to establish uniformity for technical standards of highway substructure design and to make substructure engineering design meet the requirements of safety, reliability, technical advancements, economy, and rationality. It is applicable to the substructure design of the new construction and expansion of all classified highways. The ‘substructure’ in this book includes the whole parts of highway trapezoidal cross section. That is to say, it is generally referred to as general facilities, not only the subgrade, but also the slope protection, drainage, and retaining wall are included.


This book is formulated to establish uniformity for technical standards of highway substructure design and to make substructure engineering design meet the requirements of safety, reliability, technical advancements, economy, and rationality. It is applicable to the substructure design of the new construction and expansion of all classified highways. The ‘substructure’ in this book includes the whole parts of highway trapezoidal cross section. That is to say, it is generally referred to as general facilities, not only the subgrade, but also the slope protection, drainage, and retaining wall are included.


Summarizes the experience and scientific and technological achievements of highway construction projects in China Revises the contents of substructure disease prevention and substructure disease control measures Includes the strengthens of the coordinated design of substructure and pavement

Autor*in

Wanping Wu

Themen in »Specifications for Design of Highway Substructure«

Highway Engineering Highway Substructure Drainage Protection and Retaining Structures Substructure Widening and Reconstruction Special Substructure Fill Embankment Cutting Substructure Slope Anchorage Slide Resistance Pile

Stimmen zu »Specifications for Design of Highway Substructure«

Details

ISBN: 9789819623129
Verlag: Springer Singapore
Erscheinung: 02.10.2025

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