Awang Proceedings of the International Conference on Mechanical, Manufacturing and Plant Engineering

Proceedings of the International Conference on Mechanical, Manufacturing and Plant Engineering

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ICMMPE 2025, 24–25 September, Bali, Indonesia

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Beschreibung

This book presents the latest research advancements in the field of material science, specifically in mechanical, manufacturing, and plant engineering. It includes peer reviewed articles from the 11th International Conference on Mechanical, Manufacturing and Plant Engineering (ICMMPE 2025) held on 24–25 September 2025 at Bali, Indonesia. The conference showcases cutting-edge research and facilitates knowledge exchange among experts in the field of material science, mechanical engineering and their applications.


This book presents the latest research advancements in the field of material science, specifically in mechanical, manufacturing, and plant engineering. It includes peer reviewed articles from the 11th International Conference on Mechanical, Manufacturing and Plant Engineering (ICMMPE 2025) held on 24–25 September 2025 at Bali, Indonesia. The conference showcases cutting-edge research and facilitates knowledge exchange among experts in the field of material science, mechanical engineering and their applications.


Presents selected articles from the 11th Intl. Conference on Mechanical, Manufacturing & Plant Engineering- ICMMPE 2025 Highlights latest advances and brings together researchers and professionals in these areas Provides a valuable platform for exchanging ideas and fostering collaboration between academia and industry

Autor*in

Mokhtar Awang

Themen in »Proceedings of the International Conference on Mechanical, Manufacturing and Plant Engineering«

Smart materials Material fatigue Process engineering Shape memory alloys Material stress Mechanics of materials Nano materials Casting and solidification Polymer processing

Stimmen zu »Proceedings of the International Conference on Mechanical, Manufacturing and Plant Engineering«

Details

ISBN: 9789819578160
Verlag: Springer Singapore
Erscheinung: 22.05.2026

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