Reliability Technology for Integrated Circuit Packaging
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Beschreibung
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.
Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.
Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.
Comprehensive Coverage of IC Packaging Technologies and Reliability from Fundamentals to Advanced Methods Expert Insights and Latest Techniques in IC Packaging Failure Analysis and Reliability Testing Detailed Case Studies and Practical Applications for IC Packaging Reliability in Modern Electronics
Autor*in
Bin Zhou
Themen in »Reliability Technology for Integrated Circuit Packaging«
Package Reliability Failure mechanism Failure Analysis Physical characteristics Thermal Performance