This book showcases cutting-edge research in Micro/Nanoelectronics Devices, Circuits, and Systems, presented at the 6th International Conference, MNDCS 2026 held from January 29–31, 2026, at the National Institute of Technology (NIT) Silchar in Assam, India. The volume highlights innovations that are shaping the next generation of electronic technologies. Covering semiconductor physics, quantum electronics, advanced transistors (FinFET, TFET, beyond-CMOS, III-V HEMT), 2D materials, spintronics, nanotechnology, and flexible electronics, the volume explores breakthroughs from devices to system-level integration. The book focuses on topics such as VLSI circuits, system-on-chip (SoC), reconfigurable architectures, FPGA-based design, bioelectronics, MEMS/NEMS, sensors, actuators, nanogenerators, energy harvesting, IoT/IoE smart systems, and robotics. The integration of AI/ML across devices, circuits, and microsystems is emphasized as a driver of performance, reliability, and intelligent functionality. This is a valuable resource for researchers, engineers, professionals, and graduate students, as it provides insights into emerging materials, advanced devices, circuit innovations, and system solutions for applications spanning industry, healthcare, energy, and next-generation smart technologies.
This book showcases cutting-edge research in Micro/Nanoelectronics Devices, Circuits, and Systems, presented at the 6th International Conference, MNDCS 2026 held from January 29–31, 2026, at the National Institute of Technology (NIT) Silchar in Assam, India. The volume highlights innovations that are shaping the next generation of electronic technologies. Covering semiconductor physics, quantum electronics, advanced transistors (FinFET, TFET, beyond-CMOS, III-V HEMT), 2D materials, spintronics, nanotechnology, and flexible electronics, the volume explores breakthroughs from devices to system-level integration. The book focuses on topics such as VLSI circuits, system-on-chip (SoC), reconfigurable architectures, FPGA-based design, bioelectronics, MEMS/NEMS, sensors, actuators, nanogenerators, energy harvesting, IoT/IoE smart systems, and robotics. The integration of AI/ML across devices, circuits, and microsystems is emphasized as a driver of performance, reliability, and intelligent functionality. This is a valuable resource for researchers, engineers, professionals, and graduate students, as it provides insights into emerging materials, advanced devices, circuit innovations, and system solutions for applications spanning industry, healthcare, energy, and next-generation smart technologies.
Trupti Ranjan Lenka
Microelectronics & Nanoelectronics Quantum Devices & Compact Modeling Advanced Semiconductor Materials (Graphene, CNTs, 2D Materials) Flexible & Sustainable Electronics High-Efficiency Solar Cells & Energy Storage Analog, Digital & Mixed-Mode VLSI Circuits System-on-Chip (SoC) & Reconfigurable Architectures FPGA Design, Testing & Verification MEMS/NEMS Devices & Microsystems Sensors, Actuators & Nanogenerators Microfluidics, Lab-on-Chip & Biomedical Systems IoT, Smart Systems & Embedded Applications Robotics, Mechatronics & Healthcare Technologies Reliability, Packaging & Next-Generation Electronics MNDCS 2026 proceedings