Laxminidhi Advances in Communications, Signal Processing, and VLSI

Advances in Communications, Signal Processing, and VLSI

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Select Proceedings of IC2SV 2019

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Beschreibung

This book comprises the peer-reviewed proceedings of the International Conference on Communications, Signal Processing and VLSI (IC2SV) 2019. It explores the recent advances in the fields of signal and image processing, wireless and mobile communications, embedded systems, VLSI, microwave, and antennas. The contents provide insights into present technological challenges and discusses the emerging applications of different imaging techniques and communications systems. Given the range of topics covered, this book can be useful for students as well as researchers interested in the area of communications, signal processing, and VLSI technologies.



This book comprises the peer-reviewed proceedings of the International Conference on Communications, Signal Processing and VLSI (IC2SV) 2019. It explores the recent advances in the fields of signal and image processing, wireless and mobile communications, embedded systems, VLSI, microwave, and antennas. The contents provide insights into present technological challenges and discusses the emerging applications of different imaging techniques and communications systems. Given the range of topics covered, this book can be useful for students as well as researchers interested in the area of communications, signal processing, and VLSI technologies.



Presents select proceedings of the International Conference on Communications, Signal Processing and VLSI (IC2SV) 2019 Covers latest research and applications of signal and image processing Discusses recent advances in communications systems and integrated circuits

Autor*in

T. Laxminidhi

Themen in »Advances in Communications, Signal Processing, and VLSI«

Signal processing Image processing Integrated circuit design Wired and wireless communication Embedded systems IC2SV 2019

Stimmen zu »Advances in Communications, Signal Processing, and VLSI«

Details

ISBN: 9789813340572
Verlag: Springer Singapore
Erscheinung: 13.04.2021

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