Chiplet Design and Heterogeneous Integration Packaging
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Beschreibung
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Addresses chiplet design and heterogeneous integraton packaging both in theory and practice Provides studies in design, materials, process, fabrication, and reliability of various chiplet designs Written by a veteran in the area
Autor*in
John H. Lau
Themen in »Chiplet Design and Heterogeneous Integration Packaging«
Chitlet design Chip partitioning Chip splitting Multiple system and heterogenous integration Chiplet lateral communications Bridges 2.1D, 2.3D, and 3D IC integration Hybrid bonding Through-silicon via Redistribution-layer