3D Microelectronic Packaging
From Architectures to Applications
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Beschreibung
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Provides comprehensive coverage of 3D microelectronic packages Explains the fundamentals of using solder interconnects as micro-bumps Demonstrates the advanced materials and processes used in 3D microelectronic packages Introduces readers to the 3D microelectronic package architecture and assembly process design Highlights quality and reliability concerns in 3D packaging Offers a detailed review of fault isolation and failure analysis in 3D packaging
Autor*in
Yan Li
Themen in »3D Microelectronic Packaging«
3D microelectronic packages Advanced materials in 3D packages Failure analysis microelectronic packaging Heat dissipation Metallic and polymeric packaging materials Micro bumps Quality and Reliability of 3D Packaging Solder connects in 3D packages TSV Processing and Reliability Through-silicon via