Assembly and Reliability of Lead-Free Solder Joints
Buch in deiner Nähe kaufen
Beschreibung
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Offers an exclusive overview of packages and materials available for specified characteristics Includes in-depth of mechanism analysis Covers novel materials, including solder alloys and fluxes for advanced applications Addresses reliability tests and data analyses for solder joints Designs for reliability and failure analysis of solder joints
Autor*in
John H. Lau
Themen in »Assembly and Reliability of Lead-Free Solder Joints«
Prevailing lead-free materials Soldering processes Advanced specialty flux designs Solder joint characterizations Reliability testing and data analysis Design for reliability Failure analysis
Stimmen zu »Assembly and Reliability of Lead-Free Solder Joints«
“The book gives a wide perspective on the technical insights of lead-free solder joint reliability and packaging approaches in the industry while adding very valuable solder joint reliability insights. It is a good resource to demonstrate the many facets of advance assembly of lead-free solders and can serve as a very informative technical reference. Valuable as a learning tool of semiconductor packaging and assembly reliability, its clear relevance to real-world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan and Hem Takiar, Life Cycle Reliability and Safety Engineering, July 31, 2020)
()