Osman Zahid iMEC-APCOMS 2019

iMEC-APCOMS 2019

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Proceedings of the 4th International Manufacturing Engineering Conference and The 5th Asia Pacific Conference on Manufacturing Systems

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Beschreibung

This book presents the proceedings of the 4th International Manufacturing Engineering Conference and 5th Asia Pacific Conference on Manufacturing Systems (iMEC-APCOMS 2019), held in Putrajaya, Malaysia, on 21–22 August 2019. Covering scientific research in the field of manufacturing engineering, with focuses on industrial engineering, materials, processes, the book appeals to researchers, academics, scientists, students, engineers and practitioners who are interested in the latest developments and applications related to manufacturing engineering.


This book presents the proceedings of the 4th International Manufacturing Engineering Conference and 5th Asia Pacific Conference on Manufacturing Systems (iMEC-APCOMS 2019), held in Putrajaya, Malaysia, on 21–22 August 2019. Covering scientific research in the field of manufacturing engineering, with focuses on industrial engineering, materials, processes, the book appeals to researchers, academics, scientists, students, engineers and practitioners who are interested in the latest developments and applications related to manufacturing engineering.

Presents the proceedings of the 4th International Manufacturing Engineering Conference and 5th Asia Pacific Conference on Manufacturing Systems (iMEC-APCOMS 2019) Includes papers written by leading experts covering the latest advances in manufacturing engineering and other related topics Provides an overview of the rapid advances in manufacturing engineering, particularly in the context of Industry 4.0

Autor*in

Muhammed Nafis Osman Zahid

Themen in »iMEC-APCOMS 2019«

iMEC-APCOMS Putrajaya Materials Manufacturing Processes Automation Manufacturing Systems Industrial Engineering Production Process Planning Logistic and Supply Chain Management Total Productive Maintenance

Stimmen zu »iMEC-APCOMS 2019«

Details

ISBN: 9789811509520
Verlag: Springer Singapore
Erscheinung: 27.10.2020

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