Heterogeneous Integrations
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Beschreibung
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Addresses heterogeneous integration systems both in theory and practice Comprehensively addresses heterogeneous integration system design, materials, processes, fabrication, and reliability assessments Presents the latest research and development findings, offering a “one-stop” guide to the state of the art of heterogeneous integration Studies major heterogeneous integration methods and techniques in advanced semiconductor packaging
Autor*in
John H. Lau
Themen in »Heterogeneous Integrations«
System-on-Chip System-in-Package Heterogeneous Integration Redistribution-Layers Silicon Substrates (TSV-Interposers) Silicon Substrates (Bridges) Organic Substrates (Build-Up Layers) Fan-Out Substrates (TSV-Less Interposers) Multichips (ASIC, Memory, GPU, CPU, etc.) Photonics (MEMS, LED, VCSEL, etc.)