Advanced Liquid Metal Cooling for Chip, Device and System
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Beschreibung
This is the first book to summarize the core principles and practical applications of a novel, advanced chip-cooling category: liquid-metal cooling. It describes the science and implementation of room- temperature liquid-metal enabled cooling for chips, devices and systems. It outlines the basic features of liquid-metal-based enhanced heat transfer and offers an overview of selected fundamental and practical issues. Lastly, it explains the key mechanisms behind these next-generation advanced cooling approaches, and proposes future research directions.
Discussing major breakthrough features, unique scientific and practical merits, and intriguing liquid metal coolant or medium behaviors in connection with powerful next-generation cooling systems, the book appeal to a broad readership. Further, the combination of key fundamental and practical aspects offers inspiration for researchers looking for new ways of making advanced cooling systems to meet the increasingly pressing needs of today’s highly integrated chip industry.
This is the first book to summarize the core principles and practical applications of a novel, advanced chip-cooling category: liquid-metal cooling. It describes the science and implementation of room- temperature liquid-metal enabled cooling for chips, devices and systems. It outlines the basic features of liquid-metal-based enhanced heat transfer and offers an overview of selected fundamental and practical issues. Lastly, it explains the key mechanisms behind these next-generation advanced cooling approaches, and proposes future research directions.
Discussing major breakthrough features, unique scientific and practical merits, and intriguing liquid metal coolant or medium behaviors in connection with powerful next-generation cooling systems, the book appeal to a broad readership. Further, the combination of key fundamental and practical aspects offers inspiration for researchers looking for new ways of making advanced cooling systems to meet the increasingly pressing needs of today’s highly integrated chip industry.
Demonstrates how room-temperature liquid metal can open a new era in chip cooling
Describes how revolutionary coolants and media are reshaping modern heat transfer science
Illustrates the innovative solutions for increasingly powerful chips, devices, and systems that the new cooling offers
Autor*in
Jing Liu
Themen in »Advanced Liquid Metal Cooling for Chip, Device and System«
Advanced Cooling Electronics Cooling Energy Harvesting Heat Transfer Enhancement High Flux Chip Liquid Metal Optoelectronic Devices Power System Thermal Management