Modeling and Application of Flexible Electronics Packaging
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Beschreibung
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Is the first book available on modeling and applications of transfer printing of flexible electronics Includes multiple processes developed according to the geometric shape of chips and devices Offers detailed modeling and computation steps for each process Discusses transfer printing equipment to help readers quickly learn how to use it
Autor*in
YongAn Huang
Themen in »Modeling and Application of Flexible Electronics Packaging«
Flexible electronics Electronic packaging Transfer printing Laser-assisted transfer Picking-up and placing-on transfer printing equipment