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Transactions on Engineering Technologies

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World Congress on Engineering and Computer Science 2015

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Beschreibung

This proceedings volume contains selected revised and extended research articles written by researchers who participated in the World Congress on Engineering and Computer Science 2015, held in San Francisco, USA, 21-23 October 2015. Topics covered include engineering mathematics, electrical engineering, circuits, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications.

The book offers the reader an overview of the state of the art in engineering technologies, computer science, systems engineering and applications, and will serve as an excellent reference work for researchers and graduate students working in these fields.


This proceedings volume contains selected revised and extended research articles written by researchers who participated in the World Congress on Engineering and Computer Science 2015, held in San Francisco, USA, 21-23 October 2015. Topics covered include engineering mathematics, electrical engineering, circuits, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications.

The book offers the reader an overview of the state of the art in engineering technologies, computer science, systems engineering and applications, and will serve as an excellent reference work for researchers and graduate students working in these fields.


Includes supplementary material: sn.pub/extras

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Sio-Iong Ao

Themen in »Transactions on Engineering Technologies«

Analog Signal Processing Analog circuits and filters Digital Signal Processing VLSI Systems and Applications Computational Methods and Optimizatio Biomedical Circuits and Systems Power electronics and systems Optical Communication Systems Wireless Communication Systems Sensory Systems Multiple Access Techniques Multi-User Detection Power System Stability

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Details

ISBN: 9789811027178
Verlag: Springer Singapore
Erscheinung: 04.02.2017

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