Electrochemical processes to form the metallization of high efficient silicon solar cells are developed. Direct metal plating on silicon, aluminum and indium tin oxide is investigated. Advanced process routes for metallization of back contact solar cells are established and the formed metal stacks are characterized regarding layer interfaces. A novel electrochemical printing process which enables local structuring of metal layers is presented.
Within this work electrochemical processes for manufacturing of novel silicon solar cells are investigated. Direct plating of Ni and Al on n- and p-silicon is demonstrated by making use of solar cell characteristics. Homogenous Ni/Cu stacks are realized for bifacial and back contact solar cells, forming an excellent mechanical and electrical contact to silicon. For metallization of HIT solar cells, the plating behavior on ITO layers is studied. Additionally, plating processes on evaporated Al layers are developed and applied to back contact solar cells. By means of process optimization the plated metal stack on Al features sufficient adhesion and increases the lateral conductivity of the metal grid resulting in increased solar cell efficiency. An advanced metallization route for back contact solar cells which purposefully utilizes the different characteristics of the deposited metals (Al, Ni, Cu) is developed. The resulting metal stacks are characterized in detail using SEM, EDX and AES methods. Besides plating processes, local oxidizing processes for Al are established and combined with printing technologies to realize the metal contact separation for back contact solar cells.
Mathias Kamp
Fraunhofer ISE metals technology / metallurgy industrial chemistry & chemical engineering Plating solar cell metallization novel silicon solar cells activation of aluminum anodic oxidizing of aluminum Galvanische Beschichtung Solarzellenmetallisierung Neuartige Siliciumsolarzellen Aktivierung von Aluminium Anodische Oxidation von Aluminium Materialwissenschaftler Elektrochemiker