Modeling of Lossy Interconnects and Packages with Non-Ideal Power /Ground Planes

Beschreibung

Signal integrity is becoming increasingly difficult to maintain in digital systems due to fast edge rates and tighter noise margins. This work presents a methodology for the modeling and simulation of packages and PCBs for such high-speed systems. The presented models take into account the non-ideal behavior of power/ground planes and the frequency-dependent behavior of interconnects due to losses.

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Arif E Engin

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Signal integrity Simultaneous switching noise Skin effect Signalintegrität Schaltrauschen Skineffekt

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