Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz
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Beschreibung
This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical, thermal and mechanical characteristics. Moreover, it is low-cost and requires only standard manufacturing and assembly techniques. Finally, two fully-integrated 122 GHz radar sensors are demonstrated in LTCC technology.
This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical, thermal and mechanical characteristics. Moreover, it is low-cost and requires only standard manufacturing and assembly techniques. Finally, two fully-integrated 122 GHz radar sensors are demonstrated in LTCC technology.
Autor*in
Akanksha Bhutani
Themen in »Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz«
FMCW Radar LTCC-Mehrlagen-Keramiktechnologie Integrierter-Schaltkreis-Gehäusekonzept LTCC multilayered ceramic technology Surface-mounted device Millimeterwellensystem Integrated-circuit packaging concept Millimeterwave system oberflächenmontiertes Bauelement FMCW Radar