Lock-in Thermography
Basics and Use for Evaluating Electronic Devices and Materials
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Beschreibung
The book deals with lock-in thermography as a special variant of the well known IR thermography for all applications where the heat of the sample can be pulsed. Compared to steady-state thermography, the lock-in mode enables a much improved signal/noise ratio (up to 1000x) by signal averaging, a far better lateral resolution, and it may provide inherent emissivity correction. Thus, it replaces thermal failure analysis previously carried out by using conventional IR microscopy, liquid crystal imaging, or fluorescent microthermal imaging. Various experimental approaches to lock-in thermography are reviewed with special emphasis on the systems developed by the authors themselves. Thus, the book provides a useful introduction to this technique and a helpful guide for scientists and engineers working in electronic device failure analysis. It concludes with a detailed theoretical treatment of the propagation of thermal waves, which is presented as a basis for various applications, e.g., integrated circuits, MOS structures, solar cells and solar modules.
Although the first publication on lock-in thermography appeared in 1988 con cerning electronic device testing, this technique only became popular in the 1990s in connection with the nondestructive testing of materials (NDT, espe cially photothermal and thermoelastic investigations). In the early 1990s our group at the Max Planck Institute of Microstructure Physics in Halle had the task to image small leakage currents in silicon solar cells. We soon realized that neither conventional (steady-state) thermography nor the only avail able lock-in thermography system of that time was sensitive enough to image the tiny temperature differences caused by these leakage currents. Therefore we developed the "Dynamic Precision Contact Thermography" technique (DPCT), which was the first lock-in thermography system having a detection limit below 100 J. . LK. However, this system turned out to be too impractica ble for general use, since it worked in a mechanical contacting mode, and its measurement time was necessarily many hours. With the availability of highly sensitive focal plane array thermocameras at the end of the 1990s, the way was opened to construct highly sensitive IR-based lock-in thermogra phy systems. This was done independently by groups working in NDT and by us working in electronic device testing, whereby the different demands in the different fields lead to partly different approaches in the realization. For photothermal investigations a low lock-in frequency is usually used in order to see sub-surface details, and for thermoelastic investigations the thermo camera cannot usually be synchronized to the temperature modulation.
First book on lock-in thermography, an analytical method applied to the diagnosis of microelectronic devices Includes supplementary material: sn.pub/extras
This is the first book on lock-in thermography, an analytical method applied to the diagnosis of microelectronic devices. It provides the necessary knowledge on the scientific basics and application of this method. It appeals to electrical engineers, researchers and advanced students.
Autor*in
Otwin Breitenstein
Themen in »Lock-in Thermography«
Experiment Failure analysis Lifetime mapping Shunt imaging Solar cell characterization Trap density mapping basics imaging integrated circuit measurement microscopy thermography