Handbook of 3D Integration
Volume 3: 3D Process Technology
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Beschreibung
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology.
As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology.
Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.
Autor*in
Philip Garrou
Themen in »Handbook of 3D Integration«
Components & Devices Electrical & Electronics Engineering Electronic Materials Elektronische Materialien Elektrotechnik u. Elektronik Halbleiter Halbleiterphysik Halbleitertechnologie Komponenten u. Bauelemente Materials Science Materialwissenschaften Mikroelektronik Nanomaterialien Nanomaterials Nanotechnologie