Flexible Electronic Packaging and Encapsulation Technology

Beschreibung

Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology.

Autor*in

Hong Meng

Themen in »Flexible Electronic Packaging and Encapsulation Technology«

Components & Devices Electrical & Electronics Engineering Electronic Materials Elektronische Materialien Elektrotechnik u. Elektronik Halbleiterphysik Komponenten u. Bauelemente Materials Science Materialwissenschaften Physics Physik Semiconductor Physics

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