Thermal Management Materials for Electronic Packaging

Beschreibung

Summarizes the development of thermal management materials and introduces the preparation methods and application scenarios of thermal management materials for electronic packing.

Autor*in

Xingyou Tian

Themen in »Thermal Management Materials for Electronic Packaging«

Components & Devices Electrical & Electronics Engineering Electronic Materials Elektronische Materialien Elektrotechnik u. Elektronik Halbleiterphysik Komponenten u. Bauelemente Materials Science Materialwissenschaften Physics Physik Semiconductor Physics

Stimmen zu »Thermal Management Materials for Electronic Packaging«

Details

Link teilen