Handbook of 3D Integration
Volumes 1 and 2: Technology and Applications of 3D Integrated Circuits
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Beschreibung
The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics
into perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbook
presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging
technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration
to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in
detail. This is followed by fields of application and a look at the future of 3D integration.
The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon,
Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.
Beiträge von Forschern und Strategen an Universitäten und aus der Industrie diskutieren hier die physikalischen Grenzen der klassischen 2D-Elektronik und beleuchten die Erfordernisse des Marktes sowie Ansatzpunkte für zukünftige Entwicklungen.
Autor*in
Philip Garrou
Themen in »Handbook of 3D Integration«
Components & Devices Electrical & Electronics Engineering Electronic Materials Elektronische Materialien Elektrotechnik u. Elektronik Halbleiter Halbleiterphysik Halbleitertechnologie Komponenten u. Bauelemente Materials Science Materialwissenschaften Mikroelektronik Nanomaterialien Nanomaterials Nanotechnologie