Baldi Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 7

Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 7

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Proceedings of the 2018 Annual Conference on Experimental and Applied Mechanics

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Beschreibung

Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 7 of the Proceedings of the 2018 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:


Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 7 of the Proceedings of the 2018 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:



Inverse Problems/Hybrid Techniques Material Characterizations Using Thermography Thermoelastic Stress Analysis Fatigue & Damage Evaluation Using Infrared Thermography Integration of Infrared Thermography & DIC Thermographic Non-Destructive Evaluation (NDE)

Autor*in

Antonio Baldi

Themen in »Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 7«

Conference Proceedings Society for Experimental Mechanics Inverse Problems/Hybrid Techniques Material Characterizations Using Thermography Thermoelastic Stress Analysis Fatigue & Damage Evaluation Using Infrared Thermography Integration of Infrared Thermography & DIC Thermographic Non-Destructive Evaluation (NDE)

Stimmen zu »Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 7«

Details

ISBN: 9783319950730
Verlag: Springer International Publishing
Erscheinung: 10.10.2018

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