Materials for Advanced Packaging
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Beschreibung
This second edition continues to be the most comprehensive review on the developments in advanced electronic packaging technologies, with a focus on materials and processing. Recognized experts in the field contribute to 22 updated and new chapters that provide comprehensive coverage on various 3D package architectures, novel bonding and joining techniques, wire bonding, wafer thinning techniques, organic substrates, and novel approaches to make electrical interconnects between integrated circuit and substrates. Various chapters also address advances in several key packaging materials, including:
- Lead-free solders
- Flip chip underfills
- Epoxy molding compounds
- Conductive adhesives
- Die attach adhesives/films
- Thermal interface materials (TIMS)
- Materials for fabricating embedded passives including capacitors, inductors, and resistors
- Materials and processing aspects on wafer-level chip scale package (CSP) and MicroElectroMechanical system (MEMS)
Contributors also review new and emerging technologies such as Light Emitting Diode (LED) packaging, as well as packaging for medical devices, flexible and printed electronics, interconnection technologies for solar cells, and nano-metal assisted chemical etching. This book is ideal for professionals in semiconductor fabrication, packaging of electronic and optoelectronic devices and solar cells and medical device packaging areas as well as graduate students studying materials science and engineering or electronic packaging materials and processing.
This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
Provides a comprehensive summary of the most recent advances in materials development for advanced packaging Covers emerging technologies such as digital health, bio-medical and nano materials and process, and microelectronic and optoelectronic packaging Contains a balanced number of chapter authors from academia and industry, who are leaders in their respective fields
Autor*in
Daniel Lu
Themen in »Materials for Advanced Packaging«
Microelectronic packaging Adhesives and films Bonding and joining techniques Nanomaterials and nanopackaging Printed electronics MEMS packaging