Hao Gao Marion Matters-Kammerer Dusan Milosevic Peter G.M. Baltus Gao Batteryless mm-Wave Wireless Sensors

Batteryless mm-Wave Wireless Sensors

von Hao Gao Marion Matters-Kammerer Dusan Milosevic Peter G.M. Baltus

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Beschreibung

This book describes the PREMISS system, which enables readers to overcome the limitations of state-of-the-art battery-less wireless sensors in size, cost, robustness and range, with a system concept for a 60 GHz wireless sensor system with monolithic sensors.  The authors demonstrate a system in which the wireless sensors consist of wireless power receiving, sensing and communication functions in a single chip, without external components, avoiding costly IC-interfaces that are sensitive to mechanical and thermal stress.

This book describes the PREMISS system, which enables readers to overcome the limitations of state-of-the-art battery-less wireless sensors in size, cost, robustness and range, with a system concept for a 60 GHz wireless sensor system with monolithic sensors.  The authors demonstrate a system in which the wireless sensors consist of wireless power receiving, sensing and communication functions in a single chip, without external components, avoiding costly IC-interfaces that are sensitive to mechanical and thermal stress.


Discusses a phased array architecture for base stations, designed to increase power density at the sensor node by using beam forming techniques, increasing the efficiency of energy conversion Analyzes at the system level various applications at mm-wave frequencies based on a wireless power transfer techniques, such as smart sensor systems Provides design methods with design examples for mm-wave ultra-low-power circuits Provides design methods with design examples for mm-wave phased array front-end

Autor*in

Hao Gao

Themen in »Batteryless mm-Wave Wireless Sensors«

mm-wave frequencies battery-less sensors RFID beam forming techniques RF phase shifting architecture

Stimmen zu »Batteryless mm-Wave Wireless Sensors«

Details

ISBN: 9783319729794
Verlag: Springer International Publishing
Erscheinung: 25.01.2018

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