Carbon Nanotubes for Interconnects
Process, Design and Applications
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Beschreibung
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
- Provides a single-source reference on carbon nanotubes for interconnect applications;
- Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects;
- Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
Provides a single-source reference on carbon nanotubes for interconnect applications Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects Includes supplementary material: sn.pub/extras
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Themen in »Carbon Nanotubes for Interconnects«
3D Integrated Circuits Carbon Nanotubes Carbon Nanotubes and Nanostructures Graphene Graphene Nanoribbon Interconnects On-chip Interconnect TSVs for 3D Integrated Circuits
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“It can be served as a single-source reference on carbon nanotubes (CNTs) for interconnects applications. … a valuable addition to a scientific library, as well as served as good introduction for CNTs in 3D IC integrations for semiconductor packaging engineers or specialists and industrials involved in the field of CNTs materials. This book is highly recommended for people who desire a better understanding of the theory and practice of CNTs and technical considerations in 3D IC integration and device reliability.” (Chong Leong Gan, Microelectronics Reliability, January, 2017)
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