Bossuyt Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9

Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9

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Proceedings of the 2015 Annual Conference on Experimental and Applied Mechanics

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Beschreibung

Residual Stress, Thermomechanics& Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9 of the Proceedings of the 2015SEM Annual Conference& Exposition on Experimental and Applied Mechanics, the ninth volume of nine from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range ofareas, including:

Inverse Methods

Inverse Methods in Plasticity

Varying Length Scales

Harsh Environments

Opto-Acoustical Methods

Hybrid Experimental

Residual Stress Modelling and Advances in Measurements

Thermomechanics

General Material Response

Infrared Imaging

 


Residual Stress, Thermomechanics& Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9 of the Proceedings of the 2015SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the ninth volume of nine from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Inverse MethodsInverse Methods in PlasticityVarying Length ScalesHarsh EnvironmentsOpto-Acoustical MethodsHybrid ExperimentalResidual Stress Modelling and Advances in Measurements ThermomechanicsGeneral Material ResponseInfrared Imaging

Autor*in

Sven Bossuyt

Themen in »Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9«

Conf. Pro. of the Society for Experimental Mechanics DIC Digital Image Coorelation FEM Finite Element Method Residual stresses

Stimmen zu »Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 9«

Details

ISBN: 9783319217659
Verlag: Springer International Publishing
Erscheinung: 29.10.2015

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