Abraham Pattern Analysis, Intelligent Security and the Internet of Things

Pattern Analysis, Intelligent Security and the Internet of Things

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Beschreibung

This Volume presents the selected papers from the 5 Parallel Symposiums of the 2014 Fourth World Congress on Information and Communication Technologies (WICT 2014) held in Malacca, Malaysia. The theme of WICT 2014 'Innovating ICT for Social Revolutions'. WICT 2014 is Co-Organized by Machine Intelligence Research Labs (MIR Labs), USA and Universiti Teknikal Malaysia Melaka, Malaysia. WICT 2014 is technically co-sponsored by IEEE Systems, Man & Cybernetics Society Malaysia and Spain Chapters and Technically Supported by IEEE Systems Man and Cybernetics Society, Technical Committee on Soft Computing.

This Volume presents the selected papers from the 5 Parallel Symposiums of the 2014 Fourth World Congress on Information and Communication Technologies (WICT 2014) held in Malacca, Malaysia. The theme of WICT 2014 'Innovating ICT for Social Revolutions'. WICT 2014 is Co-Organized by Machine Intelligence Research Labs (MIR Labs), USA and Universiti Teknikal Malaysia Melaka, Malaysia. WICT 2014 is technically co-sponsored by IEEE Systems, Man & Cybernetics Society Malaysia and Spain Chapters and Technically Supported by IEEE Systems Man and Cybernetics Society, Technical Committee on Soft Computing.

Recent research on Pattern Analysis, Intelligent Security and the Internet of Things Focused and selected results of the 4th World Congress on Information and Communication Technologies held at December 8-10 2014 in Malacca, Malaysia Edited outcome of specialized tracks on Pattern Analysis, Intelligent Security and the Internet of Things Includes supplementary material: sn.pub/extras

Autor*in

Ajith Abraham

Themen in »Pattern Analysis, Intelligent Security and the Internet of Things«

Intelligent Computing Intelligent Security Intelligent Systems Internet of Things Pattern Analysis complexity

Stimmen zu »Pattern Analysis, Intelligent Security and the Internet of Things«

Details

ISBN: 9783319173979
Verlag: Springer International Publishing
Erscheinung: 06.07.2015

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