da Silva 3rd International Conference on Industrial Applications of Adhesives 2024

3rd International Conference on Industrial Applications of Adhesives 2024

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Selected Contributions of IAA 2024

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Beschreibung

This book offers selected papers presented at the 3rd International Conference on Industrial Applications of Adhesives, held in Cascais, Portugal, March 7-8, 2024. The goal of the conference was to provide a unique opportunity to exchange information, present the latest results as well as to discuss issues relevant to industrial applications of adhesives. Special contributions on formulation of adhesives, pressure sensitive adhesives, adhesive properties, design of adhesive joints, and durability of adhesive joints have been selected for this volume. This work will appeal to a wide readership, from practitioners through graduate students to researchers working in this field.


This book offers selected papers presented at the 3rd International Conference on Industrial Applications of Adhesives, held in Cascais, Portugal, March 7-8, 2024. The goal of the conference was to provide a unique opportunity to exchange information, present the latest results as well as to discuss issues relevant to industrial applications of adhesives. Special contributions on formulation of adhesives, pressure sensitive adhesives, adhesive properties, design of adhesive joints, and durability of adhesive joints have been selected for this volume. This work will appeal to a wide readership, from practitioners through graduate students to researchers working in this field.


Provides typical examples of industrial applications of adhesives Presents latest applied research in adhesives Offers helpful case studies in adhesive bonding

Autor*in

Lucas F. M. da Silva

Themen in »3rd International Conference on Industrial Applications of Adhesives 2024«

Adhesive development and properties Adhesive bonding Industrial applications Conference Proceedings IAA 2024 Automotive industry Aeronautical industry

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Details

ISBN: 9783031695032
Verlag: Springer International Publishing
Erscheinung: 16.09.2024

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