Endress Proceedings of the Munich Symposium on Lightweight Design 2023

Proceedings of the Munich Symposium on Lightweight Design 2023

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Beschreibung

This book includes topics like composite structures, SHM, microstructures, material modelling, design for additive manufacturing, numerical optimization and in particular topology optimization in aerospace, automotive, and other industries. Every year, the Technical University of Munich, the Universität der Bundeswehr München, and the University of Applied Sciences in Munich invite researchers and practitioners to join the Munich Symposium on Lightweight Design. Experts from industry and academia discuss design tools, applications, and new developments. The talks are summarized in short articles and presented in this volume.


This book includes topics like composite structures, SHM, microstructures, material modelling, design for additive manufacturing, numerical optimization and in particular topology optimization in aerospace, automotive, and other industries. Every year, the Technical University of Munich, the Universität der Bundeswehr München, and the University of Applied Sciences in Munich invite researchers and practitioners to join the Munich Symposium on Lightweight Design. Experts from industry and academia discuss design tools, applications, and new developments. The talks are summarized in short articles and presented in this volume.


Gains access to the latest developments, processes, and applications in Lightweight Design Covers a vast array of special topics dealing with optimization of metallic and composite structures Includes both research and application-oriented aspects of lightweight design

Autor*in

Felix Endress

Themen in »Proceedings of the Munich Symposium on Lightweight Design 2023«

Topology optimization Manufacturing technologies High-performance lightweight structures Composite materials Tools for design and optimization Lightweight design Lightweight structures Additive manufacturing AI in lightweight construction Smart composites

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Details

ISBN: 9783031646690
Verlag: Springer International Publishing
Erscheinung: 26.07.2024

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