Salleh Recent Progress in Lead-Free Solder Technology

Recent Progress in Lead-Free Solder Technology

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Materials Development, Processing and Performances

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Beschreibung

This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying.  The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying.  The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Comprehensive overview of current developments in the emerging field of Pb-free solder technology Examines various technologies involving rigid and flexible PCB Touches upon a vast array of special topics detailing the advanced characterization and modeling techniques

Autor*in

Mohd Arif Anuar Mohd Salleh

Themen in »Recent Progress in Lead-Free Solder Technology«

composite solder intermetallic compound electronic packaging solder technology laser soldering

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Details

ISBN: 9783030934439
Verlag: Springer International Publishing
Erscheinung: 03.03.2023

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