Enakshi Bhattacharya Bhattacharya Biosensing with Silicon

Biosensing with Silicon

von Enakshi Bhattacharya

Fabrication and Miniaturization of Electrochemical and Cantilever Sensors

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Beschreibung

This book discusses two silicon biosensors: an electrochemical sensor – the Electrolyte Insulator Silicon Capacitor (EISCAP), and a mechanical resonant cantilever sensor. The author presents the principle and the technology behind the device fabrication and miniaturization, stable and reproducible functionalization protocols for bioreceptor immobilization, and the measurement and the data analysis for extracting the best performance from these sensors.
EISCAP sensors, used for the estimation of triglycerides and urea, have been improved through the use of micromachining processes. The miniaturization brought out advantages as well as challenges which are discussed in this book, resulting in a prototype mini-EISCAP with a readout circuit for fast and accurate estimation of triglycerides. The author also reports on the sensitivity improvements in the estimation of triglycerides and urea obtained with the polycrystalline silicon cantilever and its measurements in liquidmedia.

The book is ideal for materials scientists and engineers working in the field of biosensors and MicroElectroMechanical systems (MEMS) and their optimizations, as well as researchers with biochemical or biomedical expertise, in order to have a fresh and updated review on the last progresses reached with EISCAPs and cantilever sensors.

Gives an updated overview on Biosensor fabrication and miniaturization technology Discusses in detail the readout circuit for EISCAP sensors Presents surface functionalization protocols

Autor*in

Enakshi Bhattacharya

Themen in »Biosensing with Silicon«

Biosensor Fabrication BioMEMS EISCAP Sensor Miniaturization Cantilever Sensor Estimation of Triglycerides Urea Sensor Readout Circuit in Biosensors Electrochemical Sensor antibody-antigen Sensor

Stimmen zu »Biosensing with Silicon«

Details

ISBN: 9783030927141
Verlag: Springer International Publishing
Erscheinung: 01.01.2022

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