Wong Nano-Bio- Electronic, Photonic and MEMS Packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging

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Beschreibung

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including:

This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging.

Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.


Offers a comprehensive overview of nano and bio packaging that includes MD simulations, thermal interfacial materials, nanotubes and superhydrophobic self-clean Lotus surfaces, and more

Discusses nano materials as power energy sources and examines their importance on the device level

Covers nano chemistry for bio sensor/biomedical device packaging



Offers a comprehensive overview of nano and bio packaging that includes electrically conductive nanomaterials, thermal interfacial materials, nanotubes and superhydrophobic self-clean Lotus surfaces, soft materials for stretchable and flexible electronics and photonics, and more Discusses nano materials as power energy sources and examines their importance on the device level Covers nano chemistry for bio sensor/biomedical device packaging

Autor*in

C. P.(Ching-Ping) Wong

Themen in »Nano-Bio- Electronic, Photonic and MEMS Packaging«

Nanoelectronics interconnection Nanomaterials Power sources Energy harvesting Thermal conductivity BioMEMS Biosensing Nanoscale modeling Flexible electronics 3D printing

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Details

ISBN: 9783030499907
Verlag: Springer International Publishing
Erscheinung: 18.03.2021

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