Copper Electrodeposition for Nanofabrication of Electronics Devices
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Beschreibung
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as:
• ULSI wiring material based upon copper nanowiring
• Printed circuit boards
• Stacked semiconductors
• Through Silicon Via
• Smooth copper foil for Lithium-Ion battery electrodes
This book is ideal for nanotechnologists, industry professionals, and practitioners.
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Focuses on wide range of microelectronics application Describes scientific mechanism of copper electrodeposition Modern and basic knowledge about nanotechnology Includes supplementary material: sn.pub/extras
Autor*in
Kazuo Kondo
Themen in »Copper Electrodeposition for Nanofabrication of Electronics Devices«
Additive Chemistry Copper Electrodeposition Metallization Nanofabrication Printed Circuit Board Through Silicon Via ULSI Interconnect