Jin Imaging Methods for Novel Materials and Challenging Applications, Volume 3

Imaging Methods for Novel Materials and Challenging Applications, Volume 3

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Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics

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Beschreibung

Imaging Methods for Novel Materials and Challenging Applications, Volume 3: Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics, the third volume of seven from the Conference, brings together 62 contributions to this important area of research and engineering.  The collection presents early findings and case studies on fundamental and applied aspects of Experimental and Applied Mechanics, including papers on: Role of optical interferometry in advancement of material characterizationThree-dimensional imaging and volumetric correlationDigital holography and experimental mechanicsDigital image correlationMetrology and displacement measurement at different scalesOptical methods for dynamic testsOptical methods for and with MEMS and NEMSThermomechanics and infrared imaging

Imaging Methods for Novel Materials and Challenging Applications, Volume 3: Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics, the third volume of seven from the Conference, brings together 62 contributions to this important area of research and engineering.  The collection presents early findings and case studies on fundamental and applied aspects of Experimental and Applied Mechanics, including papers on: 


This is the third volume of the Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics Includes supplementary material: sn.pub/extras

Autor*in

Helena Jin

Themen in »Imaging Methods for Novel Materials and Challenging Applications, Volume 3«

Digital Holography Imaging Methods Infrared Imaging MEMS and NEMS Novel Materials Photoelastic Coating Photoelastic Testing Superelasticity Thermomechnics Volumetric Correlation

Stimmen zu »Imaging Methods for Novel Materials and Challenging Applications, Volume 3«

Details

ISBN: 9781489988997
Verlag: Springer US
Erscheinung: 15.10.2014

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